This invention introduces a semiconductor-piezoelectric device designed to minimize self-heating while amplifying phonons efficiently. This technology tackles a major challenge in computer chips: overheating. By applying a special coating made from a thin layer of aluminum scandium nitride on a very thermally conductive base, it significantly improves heat removal from high-performance devices. This combination allows heat to flow away from the chip efficiently, preventing it from getting too hot. The heterostructure supports a Sezawa mode, optimized for maximal interaction between the electric field and semiconductor charge carriers, allowing operation at 3.05 GHz with a gain of 500 dB/cm. The device also achieves an end-to-end radio frequency gain of 7.7 dB and nonreciprocal transmission of 52.6 dB with low power dissipation (2.3 mW), showcasing high power-added efficiency and a low acoustic noise figure. This innovation is useful for applications requiring efficient phonon amplification and robust thermal management, such as in advanced telecommunications, signal processing, and next-generation electronic devices. Background: Modern computer chips are incredibly powerful, but they also generate a lot of heat, which can lead to malfunctions and even permanent damage. Currently, there are various methods for chip cooling, like heat sinks and fans. These solutions work, but they can be bulky, noisy, and not always effective for very high-performance devices. This new technology offers a potentially quieter and more efficient way to manage heat in high-performance chips. Applications:
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