INV-23020
Background
In the field of electronics, there's a pressing need for components that are both flexible and versatile, prompting interest in metal oxide thin films for their insulating abilities and compatibility with standard electronics manufacturing. However, the conventional processing of these films involves high annealing temperatures, which not only confines their application to a narrow range of substrates but also necessitates complex fabrication processes, including etching. This high-temperature requirement hampers the broader adoption of metal oxide thin films, particularly in applications involving flexible or heat-sensitive materials. Removing some of these limitations would expand the use of metal oxide thin films across a range of electronics applications.
Description
Researchers at Northeastern have developed a new method for creating metal oxide thin films. This approach produces films suitable for a wide range of electronics applications, including wearables, disposable circuits, and unconventional displays, due to their high dielectric constants, wide band gaps, and chemical stability. The method uses solution-based processing, which reduces production costs and allows for the development of printable, transparent electronics. Unlike conventional techniques that require high temperatures, this method uses UV light to solidify printed patterns at around 100 °C, making it compatible with a variety of substrates, such as polymers, without losing quality. The technology has been demonstrated to work effectively, with capacitors and field-effect transistors (FETs), showing promising performance, and indicating its potential to overcome existing challenges in electronic device production.
Benefits
Applications
Opportunity
Seeking