Selective Directed Assembly-based Printing of Metal Oxide Dielectric Thin Films

INV-23020

 

Background

 In the field of electronics, there's a pressing need for components that are both flexible and versatile, prompting interest in metal oxide thin films for their insulating abilities and compatibility with standard electronics manufacturing. However, the conventional processing of these films involves high annealing temperatures, which not only confines their application to a narrow range of substrates but also necessitates complex fabrication processes, including etching. This high-temperature requirement hampers the broader adoption of metal oxide thin films, particularly in applications involving flexible or heat-sensitive materials. Removing some of these limitations would expand the use of metal oxide thin films across a range of electronics applications.

 

Description

Researchers at Northeastern have developed a new method for creating metal oxide thin films. This approach produces films suitable for a wide range of electronics applications, including wearables, disposable circuits, and unconventional displays, due to their high dielectric constants, wide band gaps, and chemical stability. The method uses solution-based processing, which reduces production costs and allows for the development of printable, transparent electronics. Unlike conventional techniques that require high temperatures, this method uses UV light to solidify printed patterns at around 100 °C, making it compatible with a variety of substrates, such as polymers, without losing quality. The technology has been demonstrated to work effectively, with capacitors and field-effect transistors (FETs), showing promising performance, and indicating its potential to overcome existing challenges in electronic device production.

 

Benefits

  • Improved chemical and thermal durability.
  • Broad compatibility across diverse substrate materials.
  • Cost-efficient production process designed for scalability.
  • Precision in high-resolution, selective deposition of films, eliminating the need for extra etching.
  • Significantly reduced annealing temperature preserving substrate integrity.

 

Applications

  • Flexible and Wearable Devices: Enabling the development of innovative electronics that are adaptable to wearables and flexible technology.
  • Touch Screens and Displays: Providing transparent conductive films that improve the functionality and responsiveness of touch interfaces and displays.
  • Energy Storage: Facilitating the creation of high-performance capacitors that offer superior energy storage capabilities.
  • Healthcare and Environmental Monitoring: Supporting the production of disposable electronic circuits tailored for monitoring applications in healthcare and environmental conservation.
  • Semiconductor Devices: Advancing semiconductor technology with improved field-effect transistors, contributing to the efficiency and performance of electronic devices.

 

Opportunity

  • License
  • Research collaboration

 

Seeking

  • Development Partner
  • Commercial Partner
  • Licensing

Patent Information: