New Liquid Cooling System for High Power Electronics Package

Provides direct cooling for data centers, microelectronics packages, and chips via a fluid cooling system. Background: During operation, high-power electronics typically generate high heat. To avoid degradation and fault within the electronics, this heat must be continuously removed. Air cooling is one traditional method of dissipating this heat. However, air cooling is limited in its heat removal capacity and is therefore not ideal for electronics and devices that require consistent, rapid cooling. Improved cooling solutions are needed that can provide consistent heat removal to cool microchips and high-power electronics, allowing these components to work efficiently over a longer period of time. Technology Overview: This technology from researchers at SUNY Polytechnic Institute is a cooling system that includes embedded channels in a top portion and parallel inlet and outlet fluid conduits in a bottom portion. The inlet fluid conduits are connected to inlet sections to provide coolant to the inlet fluid conduits, and the outlet fluid conduits are connected to the outlet sections. This allows high-temperature, fluid coolant to be constantly removed from the system and fresh cool coolant to constantly move into the channels and conduits for constant and consistent removal of heat. Stage of Development Technology Readiness Level (TRL): 4 - Technology validated in lab. Advantages: - Continuously and quickly removes heat from high power electronics
- Higher cooling capacity
- Lowers risk of electronics fault due to overheating
- Extends life of electronic components Applications: Provide direct cooling of high-power electronics. These include:
- Data centers
- Microelectronics packages
- Chips Intellectual Property Summary: Provisional patent, Patent application submitted Stage of Development: A provisional patent application has been filed for this technology. Licensing Potential: Licensing Licensing Status: This technology is available for licensing, and could be of interest to: 
- Data centers 
- Computer manufacturers 
- Microelectronics manufacturers 
- Electronic component manufacturers (chips, circuit boards, etc.) 
- Manufacturers of other devices and instruments that rely on high power electronics  https://suny.technologypublisher.com/files/sites/270-18-16adobestock_224235806.jpeg