Lensless Imaging Using Standard CMOS Foundry Processes

This invention proposes an approach to camera fabrication by leveraging a single standard Complementary Metal-Oxide-Semiconductor (CMOS) foundry process. By repurposing the metal layers already present in CMOS chips to act as a scattering mask fabricated on top of a CMOS sensor array, the technology enables lensless computational imaging. This eliminates the need for complex, bulky lenses traditionally required in camera systems. The innovation significantly streamlines manufacturing by reducing complexity, alignment errors, material costs, and the overall size of the camera.

This invention opens up the possibility of integrating camera functionality into devices where space and cost constraints previously made it prohibitive. Additionally, the absence of lenses and the reliance on computational imaging techniques lends itself to new applications in fields that benefit from computational reconstruction of images, such as advanced security systems that require stealth operation or medical devices where traditional camera systems are not viable due to size constraints. The utilization of standard CMOS processes ensures compatibility with existing manufacturing lines, thereby facilitating a smoother transition to this new technology and accelerating adoption.

Background: 
The economic implications of fabricating a complete lensless camera using a single standard CMOS foundry process are substantial. By simplifying the manufacturing pipeline, this invention can significantly reduce both material costs and labor, leading to a much more cost-effective product. The streamlining of the production process also opens the door for highthroughput manufacturing, which is crucial for economies of scale. The cost savings extend beyond the manufacturing stage, the reduced size and complexity also lower shipping and storage costs. These economic advantages make it highly competitive, especially in markets where cost is a major factor.

Applications: 

  • Computational imaging
  • Mobile telecommunications
  • Healthcare
  • Aerospace
  • Defense


Advantages: 

  • Cost effective
  • Simplified assembly and reduced manufacturing
  • Enhanced reliability due to fewer mechanical parts
  • Compatibility with existing products
Patent Information: