This invention includes, in one embodiment, a method to simplify the fabrication and assembly of cylindrical ion traps (CITs) using new materials and processes. Accordingly, a CIT was made from Low Temperature Co-fired Ceramics (LTCC), used in semi-conductor industry as a packaging material and physical MEMS and RF (MEMS) devices. The invention seemed to improve the precision of the conducting layers while on the other hand reducing the complexity involved during the fabrication of devices regardless of whether the substrate layer is conductive or otherwise. The invention also has the ability to control the patterning of the conductive layer. This invention is applicable for ion optics and any E-Beam instruments which are used for the fabrication of semiconductor devices.
Schematic to Define the Terminology Used to Describe the Dimensions of Cylindrical Ion Traps (CITs)