CIM24SAPP2-18

CIM24SAPP2-18 is a high-yielding, early-maturing maize hybrid with white grain, that is drought tolerant, NUE, and resistant to GLS, MSV, and TLB. It is suitable for cultivation for food use in tropical, rainfed, dry/wet mid-altitude and lowland ecologies in southern Africa and similar agroecologies.   General Information   Target region Southern Africa   Target region <1800 masl   Type of product Three-way cross hybrid   Year first announced 2025         Grain Characteristics   Grain color White       Grain texture Semi-dent Grain Yield       Grain yield under optimum conditions 9.62 t/ha   Biotic Stress Performance Grain yield under managed drought stress 2.13 t/ha   Turcicum leaf blight (TLB) (1-9) 4.6 Grain yield under low N stress 2.6 t/ha   Grey leaf spot (GLS) (1-9) 4.0 Grian Yield on-farm (moderate stress) 5.65  t/ha   Maize Streak Virus (MSV) (1-9) 3.7 Grain Yield on-farm (severe stress) 1.90  t/ha   Ear rots 8.1%       Diseases are scored on a 1-9 scale, where 1 = Highly resistant; 5 = Tolerant; 9 = Highly susceptible. Agronomic Characteristics     Maturity group Early       50% anthesis 59 DAP   Seed Production Characteristics 822       Anthesis-silking interval 1.29 Days   Single-cross female parent yield 8.76 t/ha Plant height 227.68 cm   Male parent yield 3.82 t/ha Ear height 113.46 cm   Nicking -4.16 Ears per plant 1.22       Ear position (ratio) 0.49   Comments Bad husk cover 6.5%   Product information is based on data from CIMMYT Southern Africa 2024 Stage 4 and 2024 Stage 5 Trials. Actual performance will vary depending on a number of agronomic and environmental factors.

Abbreviations:
DAP = days after planting
GLS = Grey Leaf Spot
low N = low soil nitrogen
MSV= Maize Streak Virus
NUE = Nitrogen Use Efficient
masl = meters above sea level
TLB = Turcicum Leaf Blight (E. turcicum) Ear aspect (1-5) 2.9   Root lodging 4.4%   Stalk lodging 2.8%   Ear aspect is scored on 1-5 scale, where 1 = desirable and 5 = undesirable characteristics           Further Links   Full Announcement   Trial Data Summary        
Patent Information: