CIM21SAPP1-01

CIM21SAPP1-01 is a late-maturing, white-grain, high-yielding, drought-tolerant maize hybrid that is NUE and resistant to GLS, TLB, Ear rots, and MSV, bred for food use in tropical, rainfed, dry/wet mid-altitude and transition ecologies in southern Africa and similar agroecologies.     General Information   Target region Southern Africa   Adaptation/Agroecological zone 400-1800 masl   Type of product Three-way cross hybrid   Year first announced 2022             Grain Characteristics Grain Yield   Grain color White Grain yield under optimum conditions 8.38 t/ha   Grain texture Semi-dent Grain yield under managed drought stress 3.17 t/ha       Grain yield under low N stress 2.84 t/ha   Biotic Stress Performance       Turcicum leaf blight (TLB) (1-9)* 5.0 Agronomic Characteristics   Grey leaf spot (GLS) (1-9)* 3.5 50% anthesis 898 GDD (°C)   Maize Streak Virus (MSV) (1-9)* 3.5 Anthesis-silking interval -0.05 Days   Ear rots 5.1% Plant height 250.3 cm   *Diseases are scored on a 1-9 scale, where 1 = Highly resistant; 5 = Tolerant; 9 = Highly susceptible. Ear height 129.1 cm   Ears per plant 1.1       Bad husk cover 3.2%   Seed Production Characteristics Ear aspect (1-5)* 2.7   SC female parent yield 8.83 t/ha Root lodging 4.3%   Male parent yield 2.26 t/ha Stalk lodging 8.3%   Nicking -5.02 days *Ear aspect is scored on 1-5 scale, where 1 = desirable and 5 = undesirable characteristics         Comments       Product information is based on data from various trials conducted by CIMMYT in southern Africa in 2021 and 2022.  Actual performance will vary depending on a number of agronomic and environmental factors.

Abbreviations:
GDD = growing degree-days
GLS = Grey Leaf Spot
Low N = managed low nitrogen stress
masl = meters above sea level
MSV = Maize Streak Virus
NUE = nitrogen-use efficient
opt. = optimum (44,444 plants per ha)
SC = single-cross
TLB = Turcicum Leaf Blight (E. turcicum) Further Links   Full product announcement, including southern Africa 2021 Regional Trial and 2022 Regional On-Farm Trial data                                     
Patent Information: