Bio-based Resins with High Content of Ethylenically Unsaturated Functional Groups and Thermosets Thereof

The patent introduces thermosetting resin systems derived predominantly from renewable, bio-based feedstocks that carry a high density of ethylenically unsaturated functional groups. These resins are formulated to undergo free-radical or crosslinking polymerization (via the multiple carbon-carbon double bonds) to yield high-performance thermosets with desirable mechanical strength, thermal stability, and chemical resistance. By replacing a substantial portion of petrochemical monomers with functionalized plant oil or other renewable derivatives, the technology provides a more sustainable alternative while maintaining competitive performance levels. The high unsaturation enables faster cure rates and tighter crosslinked networks, making these bio-based thermosets suitable for coatings, composites, adhesives, and structural applications.

Benefits

  • High renewable content, reducing dependence on petroleum-based monomers
  • Enhanced crosslink density for improved hardness, strength, and durability
  • Fast curing capability under UV or thermal initiation for efficient processing
  • Excellent thermal and chemical resistance in cured thermosets
  • Compatibility with conventional polymerization systems for easy integration into existing manufacturing lines
  • Reduced VOC emissions and improved sustainability profile
  • Versatile performance suitable for coatings, composites, and adhesives applications

Applications

  • UV-curable and thermally cured industrial and protective coatings
  • Composites and laminates for automotive, aerospace, and construction materials
  • Adhesives and sealants require strong bonding and chemical resistance
  • 3D printing resins and photopolymer formulations for additive manufacturing
  • Eco-friendly flooring, furniture, and wood coatings with high durability
  • Encapsulation materials for electronics and renewable energy components

Patents

This technology is patented, issued US Patent 10,323,119, and is available for licensing/partnering opportunities.

Patent Information: