This invention is a hardware security technology that detects physical tampering of semiconductor chips at a very early stage. It embeds optical sensing features within the back-end-of-line (BEOL) and packaging layers of standard CMOS devices. These features produce a stable optical response during normal operation, but the response changes immediately when the physical structure of the chip is disturbed. By monitoring this optical behavior in real time, the system can detect tampering as soon as protective layers are altered. This allows the device to trigger defensive actions before sensitive circuitry or data can be exposed. This approach extends beyond electrical signals and can be integrated into existing semiconductor manufacturing and packaging processes. Background: Physical attacks on integrated circuits, including delayering, polishing, and probing, are commonly used in reverse engineering and hardware attacks. These methods allow attackers to gradually remove protective layers to study or extract sensitive circuitry. Existing countermeasures typically rely on electrical continuity checks or active electrical shields that detect damage only after a conductive path has been broken. This delay creates a vulnerability window where sensitive information may already be compromised before an alarm is raised. In addition, electrical defenses can sometimes be bypassed by skilled attackers who replicate or manipulate electrical signals. This technology addresses that limitation by sensing physical changes directly through optical behavior. Since optical properties change immediately upon material modifications, the system provides earlier detection than electrical-only methods and offers stronger protection against skilled physical attacks. Applications:
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