Anti-flammable Compounds and Adhesive Materials

PRODUCT OPPORTUNITIES

• Novel compounds that impart flame retardancy
• Halogen-free anti-flammable adhesive materials

PRODUCT OPPORTUNITIES

ADVANTAGES

• Enables the preparation of halogen-free anti-flammable adhesive materials with exceptionally low hear release properties and high char residues
• Affords a broad range of adhesive formulations tailorable for specific end-use applications

TECHNOLOGY DESCRIPTION

This invention provides new chemical compositions and methods for the preparation of adhesive materials with low flammability. The low flammability is due to newly invented organic/polymeric components used in the adhesive formulation, rather than through the addition of a conventional anti-flammable additives such as halogenated organic molecules or phosphorous-containing structures.

ABOUT THE LEAD INVENTOR

Dr. Todd Emrick is a Professor in the Department of Polymer Science and Engineering. He is a prolific inventor and a Fellow of the National Academy of Inventors.

AVAILABILITY:

Available for Licensing and/or Sponsored Research

DOCKET:

UMA 13-047

PATENT STATUS:

US Patent Issued: US 9,388,273

NON-CONFIDENTIAL INVENTION DISCLOSURE

LEAD INVENTOR:

Todd S. Emrick, Ph.D.

CONTACT:

This invention provides new chemical compositions and methods for the preparation of adhesive materials with low flammability. The low flammability is due to newly invented organic/polymeric components used in the adhesive formulation, rather than through the addition of a conventional anti-flammable additives such as halogenated organic molecules or phosphorous-containing structures.