RPI ID: 2021-044-401
Innovation Summary: This invention introduces 3D printed structures that integrate thermal management and light transfer capabilities into a single component. The design includes embedded channels and reflective surfaces that optimize heat dissipation and light guidance. It supports applications in lighting systems, electronics cooling, and photonic devices. The structure is fabricated using multi-material additive manufacturing.
Challenges / Opportunities: Managing heat and light in compact systems is a persistent challenge. This technology combines both functions into a unified printed structure, reducing component count and improving efficiency. It enables compact, multifunctional designs for consumer electronics and industrial systems. The approach supports scalable fabrication and design flexibility.
Key Benefits / Advantages: ✔ Integrated thermal and optical functions ✔ Reduced component complexity ✔ Multi-material 3D printing ✔ Scalable and customizable ✔ Enhanced system efficiency
Applications: • LED lighting systems • Electronics cooling • Photonic devices
Keywords: #thermalmanagement #lighttransfer #3Dprinting #multifunctionalstructures #electronicscooling #photonicdesign
Intellectual Property: US Application 18/273100 US20240085012A1 filed 19-Jul-2023