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Glass Interposer Integrated Antennas with Reduced Cross Talk and Time Delay
Provides for Better Signal Isolation, Lower Dielectric Loss and Lower Manufacturing Cost in 3D Integrated Circuits These two types of glass interposer integrated antennas for in-plane/out-of-plane and point-to-point directional communications achieve high-speed intra-/inter-chip and board communications in 3D-IC. Three dimensional integrated circuits...
Published: 6/27/2021   |   Inventor(s): Yong Yoon, Seahee Hwangbo
Keywords(s): glass interposer integrated antenna, Through Glass Via (TGV) antenna, wireless interconnect in 3D IC
Category(s): Technology Classifications > Engineering > Electrical