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Bi-Conductive Surfaces for Boiling Enhancement
PAGE TITLEOverviewPAGE SUMMARY We report the counterintuitive mechanism of increasing boiling heat transfer by incorporating low-conductivity materials at the interface between the surface and fluid. By embedding an array of non-conductive lines into a high-conductivity substrate, in-plane variations in the local surface temperature are created. During...
Published: 1/19/2024   |   Inventor(s): Matthew Mccarthy, Md Mahamudur Rahman, Jordan Pollack
Keywords(s):  
Category(s): Energy, Mechanical & Civil Engineering, Energy > Energy: Electromechanical Systems, Energy > Energy: Heat Exchangers, Mechanical & Civil Engineering > ME-CE: HVAC, Mechanical & Civil Engineering > ME-CE: Mechanical Device