Achieving precise high-aspect-ratio nanostructures on hard optical materials presents significant technical hurdles due to the intrinsic properties of these substrates, such as sapphire’s high hardness, chemical stability, and thermal tolerance. Traditional fabrication methods often struggle with generating uniformly patterned, tall, and sharply defined features because the robust chemical and physical properties that make these materials desirable for optical applications also limit the efficacy of common etching and pattern transfer techniques. Inconsistencies like nonuniform mask thickness and imprecise etch endpoints compound the difficulty, while traditional masking materials and process configurations can lead to degraded nanoscale resolution, compromised aspect ratios, and reduced functional performance in areas such as anti-reflectivity and self-cleaning. These challenges drive the need for advanced, controlled fabrication strategies that ensure high fidelity, precise endpoint detection, and scalable production for a range of applications in nanophotonics and optoelectronics.
High-aspect-ratio sapphire nanostructures are created by depositing a thick polysilicon layer on sapphire, applying an antireflection coating, and then patterning a 200 nm photoresist layer using Lloyd’s mirror interference lithography to produce a 2D nanopillar array. The pattern is transferred through inductively coupled plasma reactive ion etching (ICP‑RIE) where oxygen plasma removes the photoresist and ARC, and low-RF HBr plasma etches the polysilicon mask to form HAR nanopillars; subsequently, a BCl3/HBr plasma etch transfers the pattern into the sapphire substrate.
Optical emission spectroscopy (OES) combined with principal component analysis (PCA) is used to identify key emission wavelengths—most notably at 395.6 nm for Al and O—and to model the etch process with a first-order response for precise endpoint detection. The process achieves tapered sapphire nanostructures with controlled dimensions and an aspect ratio that can be increased through additional etching, resulting in surfaces with enhanced optical transmittance and functional properties such as antireflection, anti-fogging, anti-dust, and scratch resistance.